Wide Bandgap Power Semiconductor Packaging

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  • Author : Katsuaki Suganuma
  • Publisher : Woodhead Publishing
  • Pages : 240 pages
  • ISBN : 0081020953
  • Rating : /5 from reviews
CLICK HERE TO GET THIS BOOK >>>Wide Bandgap Power Semiconductor Packaging

Download or Read online Wide Bandgap Power Semiconductor Packaging full in PDF, ePub and kindle. this book written by Katsuaki Suganuma and published by Woodhead Publishing which was released on 28 May 2018 with total page 240 pages. We cannot guarantee that Wide Bandgap Power Semiconductor Packaging book is available in the library, click Get Book button and read full online book in your kindle, tablet, IPAD, PC or mobile whenever and wherever You Like. Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Wide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging
  • Author : Katsuaki Suganuma
  • Publisher : Woodhead Publishing
  • Release : 28 May 2018
GET THIS BOOK Wide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power

Wide Bandgap Semiconductor Power Devices

Wide Bandgap Semiconductor Power Devices
  • Author : B. Jayant Baliga
  • Publisher : Woodhead Publishing
  • Release : 17 October 2018
GET THIS BOOK Wide Bandgap Semiconductor Power Devices

Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior to existing silicon devices. The book lays the groundwork for an understanding of an array of applications and anticipated benefits in energy savings. Authored by the Founder of the Power Semiconductor Research Center at North Carolina State University (and creator of the IGBT device), Dr. B. Jayant Baliga is one of the highest regarded experts in the field.

High Performance Packaging Technology for Wide Bandgap Semiconductor Modules

High Performance Packaging Technology for Wide Bandgap Semiconductor Modules
  • Author : Paul Mumby-Croft
  • Publisher : Unknown
  • Release : 21 May 2022
GET THIS BOOK High Performance Packaging Technology for Wide Bandgap Semiconductor Modules

The properties of wide band gap (WBG) semiconductors are beneficial to power electronics applications ranging from consumer electronics and renewable energy to electric vehicles and high-power traction applications like high-speed trains. WBG devices, properly integrated, will allow power electronics systems to be smaller, lighter, operate at higher temperatures, and at higher frequencies than previous generations of Si-based systems. These will contribute to higher efficiency, and therefore, lower lifecycle costs and lower CO2 emissions. Over 20 years have been spent developing WBG

Disruptive Wide Bandgap Semiconductors Related Technologies and Their Applications

Disruptive Wide Bandgap Semiconductors  Related Technologies  and Their Applications
  • Author : Yogesh Kumar Sharma
  • Publisher : BoD – Books on Demand
  • Release : 12 September 2018
GET THIS BOOK Disruptive Wide Bandgap Semiconductors Related Technologies and Their Applications

SiC and GaN devices have been around for some time. The first dedicated international conference on SiC and related devices, "ICSCRM," was held in Washington, DC, in 1987. But only recently, the commercialization of SiC and GaN devices has happened. Due to its material properties, Si as a semiconductor has limitations in high-temperature, high-voltage, and high-frequency regimes. With the help of SiC and GaN devices, it is possible to realize more efficient power systems. Devices manufactured from SiC and GaN have

Wafer Level Chip Scale Packaging

Wafer Level Chip Scale Packaging
  • Author : Shichun Qu,Yong Liu
  • Publisher : Springer
  • Release : 10 September 2014
GET THIS BOOK Wafer Level Chip Scale Packaging

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of

Semiconductor Power Devices

Semiconductor Power Devices
  • Author : Josef Lutz,Heinrich Schlangenotto,Uwe Scheuermann,Rik De Doncker
  • Publisher : Springer
  • Release : 16 February 2018
GET THIS BOOK Semiconductor Power Devices

Halbleiter-Leistungsbauelemente sind das Kernstück der Leistungselektronik. Sie bestimmen die Leistungsfähigkeit und machen neuartige und verlustarme Schaltungen erst möglich. In dem Band wird neben den Halbleiter-Leistungsbauelementen selbst auch die Aufbau- und Verbindungstechnik behandelt: von den physikalischen Grundlagen und der Herstellungstechnologie über einzelne Bauelemente bis zu thermomechanischen Problemen, Zerstörungsmechanismen und Störungseffekten. Die 2., überarbeitete Auflage berücksichtigt technische Neuerungen und Entwicklungen.

Thermal and Electro thermal System Simulation 2020

Thermal and Electro thermal System Simulation 2020
  • Author : Márta Rencz,Lorenzo Codecasa,Andras Poppe
  • Publisher : MDPI
  • Release : 12 January 2021
GET THIS BOOK Thermal and Electro thermal System Simulation 2020

This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at

Die Attach Materials for High Temperature Applications in Microelectronics Packaging

Die Attach Materials for High Temperature Applications in Microelectronics Packaging
  • Author : Kim S. Siow
  • Publisher : Springer
  • Release : 29 January 2019
GET THIS BOOK Die Attach Materials for High Temperature Applications in Microelectronics Packaging

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to

Wide Bandgap Semiconductors for Power Electronics

Wide Bandgap Semiconductors for Power Electronics
  • Author : Peter Wellmann,Noboru Ohtani,Roland Rupp
  • Publisher : John Wiley & Sons
  • Release : 22 November 2021
GET THIS BOOK Wide Bandgap Semiconductors for Power Electronics

A guide to the field of wide bandgap semiconductor technology Wide Bandgap Semiconductors for Power Electronics is a comprehensive and authoritative guide to wide bandgap materials silicon carbide, gallium nitride, diamond and gallium(III) oxide. With contributions from an international panel of experts, the book offers detailed coverage to the growth of these materials, their characterization, and how they are used in a variety of power electronics devices such as transistors and diodes and in the areas of quantum information

Wide Bandgap Based Devices

Wide Bandgap Based Devices
  • Author : Farid Medjdoub
  • Publisher : MDPI
  • Release : 26 May 2021
GET THIS BOOK Wide Bandgap Based Devices

Emerging wide bandgap (WBG) semiconductors hold the potential to advance the global industry in the same way that, more than 50 years ago, the invention of the silicon (Si) chip enabled the modern computer era. SiC- and GaN-based devices are starting to become more commercially available. Smaller, faster, and more efficient than their counterpart Si-based components, these WBG devices also offer greater expected reliability in tougher operating conditions. Furthermore, in this frame, a new class of microelectronic-grade semiconducting materials that have

Electronic Enclosures Housings and Packages

Electronic Enclosures  Housings and Packages
  • Author : Frank Suli
  • Publisher : Woodhead Publishing
  • Release : 15 November 2018
GET THIS BOOK Electronic Enclosures Housings and Packages

Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and

Practical Guide to Digital Manufacturing

Practical Guide to Digital Manufacturing
  • Author : Zhuming Bi
  • Publisher : Springer Nature
  • Release : 21 May 2022
GET THIS BOOK Practical Guide to Digital Manufacturing

This book covers the subject of digital manufacturing. It provides a practical guide for readers on using computer aided design (CAD), computer aided engineering (CAE) and computer aided manufacturing (CAM) and other computer assistive tools for the design of products, machines, processes and system integrations through the case studies of engineering projects. The book introduces a thorough theoretical foundation and discussion of the historical development, and enabling technologies of digital manufacturing. It also covers a broad range of computer aided

High Voltage Engineering and Applications

High Voltage Engineering and Applications
  • Author : Ayman El-Hag
  • Publisher : MDPI
  • Release : 09 April 2020
GET THIS BOOK High Voltage Engineering and Applications

This book is a collection of recent publications from researchers all over the globe in the broad area of high-voltage engineering. The presented research papers cover both experimental and simulation studies, with a focus on topics related to insulation monitoring using state-of-the-art sensors and advanced machine learning algorithms. Special attention was given in the Special Issue to partial discharge monitoring as one of the most important techniques in insulation condition assessment. Moreover, this Special Issue contains several articles which focus