Three Dimensional Integrated Circuit Design

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  • Author : Vasilis F. Pavlidis
  • Publisher : Newnes
  • Pages : 768 pages
  • ISBN : 0124104843
  • Rating : 5/5 from 1 reviews
CLICK HERE TO GET THIS BOOK >>>Three Dimensional Integrated Circuit Design

Download or Read online Three Dimensional Integrated Circuit Design full in PDF, ePub and kindle. this book written by Vasilis F. Pavlidis and published by Newnes which was released on 04 July 2017 with total page 768 pages. We cannot guarantee that Three Dimensional Integrated Circuit Design book is available in the library, click Get Book button and read full online book in your kindle, tablet, IPAD, PC or mobile whenever and wherever You Like. Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design
  • Author : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
  • Publisher : Newnes
  • Release : 04 July 2017
GET THIS BOOK Three Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design
  • Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
  • Publisher : Springer Science & Business Media
  • Release : 02 December 2009
GET THIS BOOK Three Dimensional Integrated Circuit Design

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design
  • Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
  • Publisher : Springer
  • Release : 19 May 2010
GET THIS BOOK Three Dimensional Integrated Circuit Design

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design
  • Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
  • Publisher : Springer
  • Release : 10 December 2009
GET THIS BOOK Three Dimensional Integrated Circuit Design

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the

Three dimensional Integrated Circuit Design

Three dimensional Integrated Circuit Design
  • Author : Vasilis F. Pavlidis,Eby G. Friedman
  • Publisher : Morgan Kaufmann
  • Release : 28 July 2010
GET THIS BOOK Three dimensional Integrated Circuit Design

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects

Design Automation and Analysis of Three dimensional Integrated Circuits

Design Automation and Analysis of Three dimensional Integrated Circuits
  • Author : Shamik Das
  • Publisher : Unknown
  • Release : 18 October 2021
GET THIS BOOK Design Automation and Analysis of Three dimensional Integrated Circuits

(Cont.) technologies may be leveraged to maintain acceptable die temperatures in 3-D ICs. Finally, we explore two issues for the future of 3-D integration. We determine how technology scaling impacts the effect of 3-D integration on circuit performance. We also consider how to improve the performance of digital components in a mixed-signal 3-D integrated circuit. We conclude with a look towards future 3-D IC design tools.

Physical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits
  • Author : Aida Todri-Sanial,Chuan Seng Tan
  • Publisher : CRC Press
  • Release : 19 December 2017
GET THIS BOOK Physical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3

Design of 3D Integrated Circuits and Systems

Design of 3D Integrated Circuits and Systems
  • Author : Rohit Sharma
  • Publisher : CRC Press
  • Release : 03 September 2018
GET THIS BOOK Design of 3D Integrated Circuits and Systems

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application

Design of 3D Integrated Circuits and Systems

Design of 3D Integrated Circuits and Systems
  • Author : Rohit Sharma
  • Publisher : CRC Press
  • Release : 03 September 2018
GET THIS BOOK Design of 3D Integrated Circuits and Systems

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application

Three Dimensional Integrated Circuit Design and Test

Three Dimensional Integrated Circuit Design and Test
  • Author : Jing Xie
  • Publisher : Unknown
  • Release : 18 October 2021
GET THIS BOOK Three Dimensional Integrated Circuit Design and Test

The emerging three-dimensional integrated circuits (3D ICs) is one of the most promising solutions for future IC designs. 3D stacking enables much higher memory bandwidth and much lower overhead in multi-power domain design, which provides solutions for chip-multiprocessor design in mitigating the "memory wall" and "dark-silicon" problem. At the same time, 3D technology leads to new opportunities and challenges in the field of circuit and system design techniques, EDA tools and chip testing mechanism. This dissertation presents two killer applications

Three Dimensional System Integration

Three Dimensional System Integration
  • Author : Antonis Papanikolaou,Dimitrios Soudris,Riko Radojcic
  • Publisher : Springer Science & Business Media
  • Release : 07 December 2010
GET THIS BOOK Three Dimensional System Integration

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from