Three Dimensional Integrated Circuit Design

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  • Author : Yuan Xie
  • Publisher : Springer Science & Business Media
  • Pages : 284 pages
  • ISBN : 144190784X
  • Rating : /5 from reviews
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Download or Read online Three Dimensional Integrated Circuit Design full in PDF, ePub and kindle. this book written by Yuan Xie and published by Springer Science & Business Media which was released on 02 December 2009 with total page 284 pages. We cannot guarantee that Three Dimensional Integrated Circuit Design book is available in the library, click Get Book button and read full online book in your kindle, tablet, IPAD, PC or mobile whenever and wherever You Like. We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design
  • Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
  • Publisher : Springer Science & Business Media
  • Release : 02 December 2009
GET THIS BOOK Three Dimensional Integrated Circuit Design

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the

Three dimensional Integrated Circuit Design

Three dimensional Integrated Circuit Design
  • Author : Vasilis F. Pavlidis,Eby G. Friedman
  • Publisher : Morgan Kaufmann
  • Release : 28 July 2010
GET THIS BOOK Three dimensional Integrated Circuit Design

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects

Physical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits
  • Author : Aida Todri-Sanial,Chuan Seng Tan
  • Publisher : CRC Press
  • Release : 19 December 2017
GET THIS BOOK Physical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3

Design of 3D Integrated Circuits and Systems

Design of 3D Integrated Circuits and Systems
  • Author : Rohit Sharma
  • Publisher : CRC Press
  • Release : 03 September 2018
GET THIS BOOK Design of 3D Integrated Circuits and Systems

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application

Three Dimensional Integrated Circuit Design and Test

Three Dimensional Integrated Circuit Design and Test
  • Author : Jing Xie
  • Publisher : Unknown
  • Release : 11 August 2022
GET THIS BOOK Three Dimensional Integrated Circuit Design and Test

The emerging three-dimensional integrated circuits (3D ICs) is one of the most promising solutions for future IC designs. 3D stacking enables much higher memory bandwidth and much lower overhead in multi-power domain design, which provides solutions for chip-multiprocessor design in mitigating the "memory wall" and "dark-silicon" problem. At the same time, 3D technology leads to new opportunities and challenges in the field of circuit and system design techniques, EDA tools and chip testing mechanism. This dissertation presents two killer applications

Arbitrary Modeling of TSVs for 3D Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits
  • Author : Khaled Salah,Yehea Ismail,Alaa El-Rouby
  • Publisher : Springer
  • Release : 21 August 2014
GET THIS BOOK Arbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as

VLSI SoC Design Methodologies for SoC and SiP

VLSI SoC  Design Methodologies for SoC and SiP
  • Author : Christian Piguet,Ricardo Reis,Dimitrios Soudris
  • Publisher : Springer Science & Business Media
  • Release : 06 April 2010
GET THIS BOOK VLSI SoC Design Methodologies for SoC and SiP

This book contains extended and revised versions of the best papers that were p- sented during the 16th edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 16th conference was held at the Grand Hotel of Rhodes Island, Greece (October 13–15, 2008). Previous conferences have taken place in Edinburgh, Trondheim, V- couver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice and Atlanta. VLSI-SoC 2008 was the 16th in a series of

Designing TSVs for 3D Integrated Circuits

Designing TSVs for 3D Integrated Circuits
  • Author : Nauman Khan,Soha Hassoun
  • Publisher : Springer Science & Business Media
  • Release : 22 September 2012
GET THIS BOOK Designing TSVs for 3D Integrated Circuits

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs,

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design
  • Author : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
  • Publisher : Newnes
  • Release : 04 July 2017
GET THIS BOOK Three Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions

Handbook of Approximation Algorithms and Metaheuristics

Handbook of Approximation Algorithms and Metaheuristics
  • Author : Teofilo F. Gonzalez
  • Publisher : CRC Press
  • Release : 15 May 2018
GET THIS BOOK Handbook of Approximation Algorithms and Metaheuristics

Handbook of Approximation Algorithms and Metaheuristics, Second Edition reflects the tremendous growth in the field, over the past two decades. Through contributions from leading experts, this handbook provides a comprehensive introduction to the underlying theory and methodologies, as well as the various applications of approximation algorithms and metaheuristics. Volume 1 of this two-volume set deals primarily with methodologies and traditional applications. It includes restriction, relaxation, local ratio, approximation schemes, randomization, tabu search, evolutionary computation, local search, neural networks, and other metaheuristics.

Proceedings

Proceedings
  • Author : Asim Smailagic,Nagarajan Ranganathan
  • Publisher : IEEE
  • Release : 11 August 2022
GET THIS BOOK Proceedings

The Symposium covers a range of topics: from VLSI circuits, systems, and design methods to system level design and system-on-chip issues, to bringing VLSI experience to new areas and technologies like nano- and molecular devices. Future design methodologies are also one of the key topics at the symposium, as well as new CAD tools to support them. Over almost two decades this has been an unique forum promoting multidisciplinary research and new visionary research approaches in the area of VLSI.