Reliability And Failure Analysis Of High Power Led Packaging

Led Packaging For Lighting Applications Book PDF
✏Book Title : LED Packaging for Lighting Applications
✏Author : Sheng Liu
✏Publisher : John Wiley & Sons
✏Release Date : 2011-07-05
✏Pages : 352
✏ISBN : 9780470827833
✏Available Language : English, Spanish, And French

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✏LED Packaging for Lighting Applications Book Summary : "This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--

Advanced Engineering Research Book PDF
✏Book Title : Advanced Engineering Research
✏Author : Yun Hae Kim
✏Publisher : Trans Tech Publications Ltd
✏Release Date : 2014-04-09
✏Pages : 1610
✏ISBN : 9783038264606
✏Available Language : English, Spanish, And French

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✏Advanced Engineering Research Book Summary : Collection of selected, peer reviewed papers from the 2014 2nd International Forum on Mechanical and Material Engineering, (IFMME 2014), March 8-9, 2014, Zhuhai, China. The 301 papers are grouped as follows: Chapter 1: Mechanical Dynamics and Vibration, Chapter 2: Mechanical Strength, Chapter 3: Mechanical Friction, Wear and Lubrication, Chapter 4: Mechanical and Construction Design and Engineering, Chapter 5: Vehicle Engineering, Chapter 6: Robot Technology and Applications, Chapter 7: Advanced Materials, Chapter 8: Metal and Alloys, Chapter 9: Composite Materials, Chapter 10: Thin-Film Materials and Coatings, Chapter 11: Bioresearch and Environmental Materials, Chapter 12: Processing Technologies, Chapter 13: Mineral Mining and Processing, Chapter 14: Electronics Systems and Technologies, Chapter 15: Signal and Data Processing Technology, Chapter 16: Algorithms and Analysis, Chapter 17: Information and Computation Technologies and Applications, Chapter 18: Industrial Engineering and Engineering Management

Solid State Lighting Reliability Part 2 Book PDF
✏Book Title : Solid State Lighting Reliability Part 2
✏Author : Willem Dirk van Driel
✏Publisher : Springer
✏Release Date : 2017-08-13
✏Pages : 606
✏ISBN : 9783319581750
✏Available Language : English, Spanish, And French

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✏Solid State Lighting Reliability Part 2 Book Summary : In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.

Thermal Management For Led Applications Book PDF
✏Book Title : Thermal Management for LED Applications
✏Author : Clemens J.M. Lasance
✏Publisher : Springer Science & Business Media
✏Release Date : 2013-09-17
✏Pages : 551
✏ISBN : 9781461450917
✏Available Language : English, Spanish, And French

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✏Thermal Management for LED Applications Book Summary : Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

Analysis Of Solder Joint Reliability Of High Power Leds By Transient Thermal Testing And Transient Finite Element Simulations Book PDF
✏Book Title : Analysis of Solder Joint Reliability of High Power LEDs by Transient Thermal Testing and Transient Finite Element Simulations
✏Author :
✏Publisher :
✏Release Date : 2015
✏Pages :
✏ISBN : OCLC:1052070946
✏Available Language : English, Spanish, And French

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✏Analysis of Solder Joint Reliability of High Power LEDs by Transient Thermal Testing and Transient Finite Element Simulations Book Summary : Abstract: An innovative sensitive test method is developed to detect solder joint cracking for high power LED packages. The method is based on transient thermal analysis and can fully replace the still dominating light-on test. For experimental application of the model, test groups of LED packages were soldered with two different lead free solders (SnAgCu305 and Innolot FL-640) on Aluminum Insulated Metal Substrate (Al-IMS) and exposed to temperature cycles. Transient thermal measurements were performed directly after assembly and after specific cycle numbers. After data processing the increase of the relative thermal resistance between the initial signal at "0" cycles and " n " cycles is obtained and correlated with cracks in the solder joint by cross sections. Based on the CAD and material data of the LED package a finite element (FE) model is set up. The time-resolved temperature curves are properly reproduced by transient thermal simulation. The measured "0" cycle curves are fitted using the FE model by adjusting a few material parameters within their allowed tolerance range. A parameter sensitivity analysis is performed. The impact of a crack in the solder joint between package and printed circuit board (PCB) on the time resolved temperature curve is simulated. The simulated crack propagates from the corner of the package to its center. The experimental measured curves are reproduced. Based on the simulation a failure criteria is defined, representing a crack length between 20% and 30% of the solder joint area, and Weibull curves are calculated. A higher creep resistance for the test group soldered with Innolot FL-640 compared to the test group soldered with SAC305 is observed.

Solid State Lighting Reliability Book PDF
✏Book Title : Solid State Lighting Reliability
✏Author : W.D. van Driel
✏Publisher : Springer Science & Business Media
✏Release Date : 2012-09-06
✏Pages : 618
✏ISBN : 9781461430674
✏Available Language : English, Spanish, And French

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✏Solid State Lighting Reliability Book Summary : Solid State Lighting Reliability: Components to Systems begins with an explanation of the major benefits of solid state lighting (SSL) when compared to conventional lighting systems including but not limited to long useful lifetimes of 50,000 (or more) hours and high efficacy. When designing effective devices that take advantage of SSL capabilities the reliability of internal components (optics, drive electronics, controls, thermal design) take on critical importance. As such a detailed discussion of reliability from performance at the device level to sub components is included as well as the integrated systems of SSL modules, lamps and luminaires including various failure modes, reliability testing and reliability performance. A follow-up, Solid State Lighting Reliability Part 2, was published in 2017.

Modeling And Simulation For Microelectronic Packaging Assembly Book PDF
✏Book Title : Modeling and Simulation for Microelectronic Packaging Assembly
✏Author : Sheng Liu
✏Publisher : John Wiley & Sons
✏Release Date : 2011-08-24
✏Pages : 288
✏ISBN : 9780470828410
✏Available Language : English, Spanish, And French

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✏Modeling and Simulation for Microelectronic Packaging Assembly Book Summary : Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Reliability Of Rohs Compliant 2d And 3d Ic Interconnects Book PDF
✏Book Title : Reliability of RoHS Compliant 2D and 3D IC Interconnects
✏Author : John Lau
✏Publisher : McGraw Hill Professional
✏Release Date : 2010-10-22
✏Pages : 560
✏ISBN : 9780071753807
✏Available Language : English, Spanish, And French

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✏Reliability of RoHS Compliant 2D and 3D IC Interconnects Book Summary : Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration

📒Led Lighting ✍ T. Q. Khan

Led Lighting Book PDF
✏Book Title : LED Lighting
✏Author : T. Q. Khan
✏Publisher : John Wiley & Sons
✏Release Date : 2014-11-24
✏Pages : 520
✏ISBN : 9783527670161
✏Available Language : English, Spanish, And French

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✏LED Lighting Book Summary : Promoting the design, application and evaluation of visually and electrically effective LED light sources and luminaires for general indoor lighting as well as outdoor and vehicle lighting, this book combines the knowledge of LED lighting technology with human perceptual aspects for lighting scientists and engineers. After an introduction to the human visual system and current radiometry, photometry and color science, the basics of LED chip and phosphor technology are described followed by specific issues of LED radiometry and the optical, thermal and electric modeling of LEDs. This is supplemented by the relevant practical issues of pulsed LEDs, remote phosphor LEDs and the aging of LED light sources. Relevant human visual aspects closely related to LED technology are described in detail for the photopic and the mesopic range of vision, including color rendering, binning, whiteness, Circadian issues, as well as flicker perception, brightness, visual performance, conspicuity and disability glare. The topic of LED luminaires is discussed in a separate chapter, including retrofit LED lamps, LED-based road and street luminaires and LED luminaires for museum and school lighting. Specific sections are devoted to the modularity of LED luminaires, their aging and the planning and evaluation methods of new LED installations. The whole is rounded off by a summary and a look towards future developments.

International Conference On Solid State Lighting Book PDF
✏Book Title : International Conference on Solid State Lighting
✏Author :
✏Publisher :
✏Release Date : 2006
✏Pages :
✏ISBN : UOM:39015064356887
✏Available Language : English, Spanish, And French

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✏International Conference on Solid State Lighting Book Summary :

Current Development Of Mechanical Engineering And Energy Book PDF
✏Book Title : Current Development of Mechanical Engineering and Energy
✏Author : J.X. Shao
✏Publisher : Trans Tech Publications Ltd
✏Release Date : 2014-02-06
✏Pages : 1982
✏ISBN : 9783038263845
✏Available Language : English, Spanish, And French

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✏Current Development of Mechanical Engineering and Energy Book Summary : Collection of selected, peer reviewed papers from the 2013 International Symposium on Vehicle, Mechanical, and Electrical Engineering (ISVMEE 2013), December 21-22, 2013, Taiwan, China. Volume is indexed by Thomson Reuters CPCI-S (WoS). The 420 papers are grouped as follows: Chapter 1: Vehicle and Transportation Engineering; Chapter 2: Design and Manufacturing Technology in Mechanical Engineering; Chapter 3: Measurement and Instrumentation, Monitoring and Detection Technologies, Fault Diagnosis; Chapter 4: Industrial Robotics, Mechatronics and Control; Chapter 5: Electrical Engineering, Electrical Machines and Apparatus, Power Electronics; Chapter 6: Power System and Energy Engineering

Advances In Mechanical Design Book PDF
✏Book Title : Advances in Mechanical Design
✏Author : Jian Min Zeng
✏Publisher : Trans Tech Publications Ltd
✏Release Date : 2011-02-21
✏Pages : 1800
✏ISBN : 9783038135814
✏Available Language : English, Spanish, And French

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✏Advances in Mechanical Design Book Summary : This book describes the latest advances in, and applications of, dynamic mechanical analysis, optimization and control, mechanical transmission theory and applications, mechanical reliability theory and engineering, theory and application of friction and wear, vibration, noise analysis and control, mechanical dynamics and its applications, heat and heat engineering, etc. It provides a comprehensive survey of the latest advance, and also constitutes a valuable reference source for researchers in this field. Volume is indexed by Thomson Reuters CPCI-S (WoS).

Manufacturing Process Technology Book PDF
✏Book Title : Manufacturing Process Technology
✏Author : Zheng Yi Jiang
✏Publisher : Trans Tech Publications Ltd
✏Release Date : 2011-02-21
✏Pages : 4482
✏ISBN : 9783038135784
✏Available Language : English, Spanish, And French

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✏Manufacturing Process Technology Book Summary : This special volume aims to bring together the latest advances in, and applications of, surface engineering/coatings, modeling, analysis and simulation, materials forming, materials machining, welding and joining, laser-processing technology, casting and solidification, precision manufacturing technology and measurements, etc. It will not only furnish readers with a broad overview of the latest advances, but also provide a valuable summary and reference work for researchers in this field.

📒High Reliability Devices ✍ RCA Corporation. Solid State Division

High Reliability Devices Book PDF
✏Book Title : High reliability Devices
✏Author : RCA Corporation. Solid State Division
✏Publisher :
✏Release Date : 1973
✏Pages :
✏ISBN : UOM:39015004523661
✏Available Language : English, Spanish, And French

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✏High reliability Devices Book Summary :

📒High Reliability Devices ✍ Radio Corporation of America. Solid State Division

High Reliability Devices Book PDF
✏Book Title : High Reliability Devices
✏Author : Radio Corporation of America. Solid State Division
✏Publisher :
✏Release Date : 1973
✏Pages : 576
✏ISBN : PSU:000029466221
✏Available Language : English, Spanish, And French

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✏High Reliability Devices Book Summary :

Microelectronic Failure Analysis Book PDF
✏Book Title : Microelectronic Failure Analysis
✏Author : Richard J. Ross
✏Publisher : Asm International
✏Release Date : 1999
✏Pages : 643
✏ISBN : UOM:39015055923034
✏Available Language : English, Spanish, And French

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✏Microelectronic Failure Analysis Book Summary : Forty-seven papers on electronics failure analysis provide an overview for newcomers to the field and a reference tool for the experienced analyst. Topics include electron/ion bean-based techniques, deprocessing and sample preparation, and physical/chemical defect characterization. For the fourth ed

📒1998 International Conference On Multichip Modules And High Density Packaging ✍ International Microelectronics and Packaging Society

1998 International Conference On Multichip Modules And High Density Packaging Book PDF
✏Book Title : 1998 International Conference on Multichip Modules and High Density Packaging
✏Author : International Microelectronics and Packaging Society
✏Publisher : IEEE
✏Release Date : 1998-04
✏Pages : 547
✏ISBN : CORNELL:31924086989179
✏Available Language : English, Spanish, And French

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✏1998 International Conference on Multichip Modules and High Density Packaging Book Summary : Now in its seventh year, MCM has expanded to reflect the evolution and applications since 1992. The MCMs most commonly envisioned in 1992 interconnected 60 to 100 chips on a thin film substrate.

Thermal Stress And Strain In Microelectronics Packaging Book PDF
✏Book Title : Thermal Stress and Strain in Microelectronics Packaging
✏Author : John Lau
✏Publisher : Springer Science & Business Media
✏Release Date : 2012-12-06
✏Pages : 884
✏ISBN : 9781468477672
✏Available Language : English, Spanish, And French

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✏Thermal Stress and Strain in Microelectronics Packaging Book Summary : Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

Journal Of Electronic Packaging Book PDF
✏Book Title : Journal of Electronic Packaging
✏Author :
✏Publisher :
✏Release Date : 2004
✏Pages :
✏ISBN : UCSD:31822032923013
✏Available Language : English, Spanish, And French

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✏Journal of Electronic Packaging Book Summary :

📒Testing Packaging And Reliability Of Semiconductor Lasers V ✍ Society of Photo-optical Instrumentation Engineers

Testing Packaging And Reliability Of Semiconductor Lasers V Book PDF
✏Book Title : Testing Packaging and Reliability of Semiconductor Lasers V
✏Author : Society of Photo-optical Instrumentation Engineers
✏Publisher : Society of Photo Optical
✏Release Date : 2000
✏Pages : 320
✏ISBN : UOM:39015050121378
✏Available Language : English, Spanish, And French

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✏Testing Packaging and Reliability of Semiconductor Lasers V Book Summary :

Quantum Well Laser Array Packaging Book PDF
✏Book Title : Quantum Well Laser Array Packaging
✏Author : Jens Tomm
✏Publisher : McGraw Hill Professional
✏Release Date : 2007
✏Pages : 428
✏ISBN : 9780071460323
✏Available Language : English, Spanish, And French

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✏Quantum Well Laser Array Packaging Book Summary : Quantum-well lasers offer the promise of lightning-fast data communications - 10-to-100 times faster than broadband. While the architecture for these devices already exists, they suffer from material packaging problems. This book addresses this critical issue. It offers screening and packaging techniques useful for researchers.

5th Electronics Packaging Technology Conference Book PDF
✏Book Title : 5th Electronics Packaging Technology Conference
✏Author : Mahadevan K. Iyer
✏Publisher : IEEE Computer Society Press
✏Release Date : 2003
✏Pages : 827
✏ISBN : 0780382056
✏Available Language : English, Spanish, And French

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✏5th Electronics Packaging Technology Conference Book Summary :

International Conference On Experimental Mechanics Book PDF
✏Book Title : International Conference on Experimental Mechanics
✏Author :
✏Publisher :
✏Release Date : 2002
✏Pages :
✏ISBN : UOM:39015048324175
✏Available Language : English, Spanish, And French

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✏International Conference on Experimental Mechanics Book Summary :

Reliability Physics 1981 Book PDF
✏Book Title : Reliability Physics 1981
✏Author :
✏Publisher :
✏Release Date : 1981
✏Pages : 310
✏ISBN : UCSD:31822005880612
✏Available Language : English, Spanish, And French

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✏Reliability Physics 1981 Book Summary :

Electronic Packaging And Production Book PDF
✏Book Title : Electronic Packaging and Production
✏Author :
✏Publisher :
✏Release Date : 1984
✏Pages :
✏ISBN : UIUC:30112008143551
✏Available Language : English, Spanish, And French

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✏Electronic Packaging and Production Book Summary :

Proceedings Book PDF
✏Book Title : Proceedings
✏Author :
✏Publisher : Institute of Electrical & Electronics Engineers(IEEE)
✏Release Date : 1998
✏Pages : 547
✏ISBN : 0780348508
✏Available Language : English, Spanish, And French

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✏Proceedings Book Summary : Annotation Now in its seventh year, MCM has expanded to reflect the evolution and applications since 1992. The MCMs most commonly envisioned in 1992 interconnected 60 to 100 chips on a thin film substrate.

Experimental Mechanics In Nano And Biotechnology Book PDF
✏Book Title : Experimental Mechanics in Nano and Biotechnology
✏Author : Soon Bok Lee
✏Publisher : Trans Tech Publications Ltd
✏Release Date : 2006-12-01
✏Pages : 1920
✏ISBN : 9783038130659
✏Available Language : English, Spanish, And French

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✏Experimental Mechanics in Nano and Biotechnology Book Summary : Volume is indexed by Thomson Reuters CPCI-S (WoS). The main focus of this book is the rapidly expanding new field of experimental mechanics, as applied to nano and biotechnology, which is enthusiastically responding to the advances in these technologies and to the increasing need for precise measurements of novel materials and biological tissues. For instance, whereas optical techniques had previously been preferred, particularly in the field of bio-engineering, other mature methods are now being exploited in tandem with the growth in micro- and nano-manufacturing.

📒2004 54th Electronic Components And Technology Conference ✍ IEEE Components, Packaging and Manufacturing Technology Society Staff

2004 54th Electronic Components And Technology Conference Book PDF
✏Book Title : 2004 54th Electronic Components and Technology Conference
✏Author : IEEE Components, Packaging and Manufacturing Technology Society Staff
✏Publisher : Institute of Electrical & Electronics Engineers(IEEE)
✏Release Date : 2004
✏Pages : 2110
✏ISBN : 0780383656
✏Available Language : English, Spanish, And French

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✏2004 54th Electronic Components and Technology Conference Book Summary :

In Plane Semiconductor Lasers Book PDF
✏Book Title : In plane Semiconductor Lasers
✏Author :
✏Publisher :
✏Release Date : 1998
✏Pages :
✏ISBN : UOM:39015047422574
✏Available Language : English, Spanish, And French

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✏In plane Semiconductor Lasers Book Summary :

Science Abstracts Book PDF
✏Book Title : Science Abstracts
✏Author :
✏Publisher :
✏Release Date : 1997
✏Pages :
✏ISBN : OSU:32435059588657
✏Available Language : English, Spanish, And French

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✏Science Abstracts Book Summary :