Reliability and Failure Analysis of High Power LED Packaging

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  • Author : Cher Ming Tan
  • Publisher : Woodhead Publishing
  • Pages : 265 pages
  • ISBN : 9780128224083
  • Rating : /5 from reviews
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Download or Read online Reliability and Failure Analysis of High Power LED Packaging full in PDF, ePub and kindle. this book written by Cher Ming Tan and published by Woodhead Publishing which was released on 15 August 2021 with total page 265 pages. We cannot guarantee that Reliability and Failure Analysis of High Power LED Packaging book is available in the library, click Get Book button and read full online book in your kindle, tablet, IPAD, PC or mobile whenever and wherever You Like. Reliability and Failure Analysis of High Power LED Packaging provides the fundamental understanding of the reliability and failure analysis materials interfaces for high power LEDs packaging with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide new insights for readers regarding the different possible failure mechanisms in high power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to a harsher stress conditions that high-power LEDs have to face. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high power LEDs under varying environmental conditions and methods of how to test, simulate and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high power LEDs

Reliability and Failure Analysis of High Power LED Packaging

Reliability and Failure Analysis of High Power LED Packaging
  • Author : Cher Ming Tan,Preetpal Singh
  • Publisher : Woodhead Publishing
  • Release : 15 August 2021
GET THIS BOOK Reliability and Failure Analysis of High Power LED Packaging

Reliability and Failure Analysis of High Power LED Packaging provides the fundamental understanding of the reliability and failure analysis materials interfaces for high power LEDs packaging with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of

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  • Publisher : Springer Science & Business Media
  • Release : 06 September 2012
GET THIS BOOK Solid State Lighting Reliability

Solid State Lighting Reliability: Components to Systems begins with an explanation of the major benefits of solid state lighting (SSL) when compared to conventional lighting systems including but not limited to long useful lifetimes of 50,000 (or more) hours and high efficacy. When designing effective devices that take advantage of SSL capabilities the reliability of internal components (optics, drive electronics, controls, thermal design) take on critical importance. As such a detailed discussion of reliability from performance at the device level to

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  • Publisher : DEStech Publications, Inc
  • Release : 24 June 2014
GET THIS BOOK International Conference on Energy and Power Engineering EPE2014

The 2014 International Conference on Energy and Power Engineering (EPE2014), will be held on April 26–27, 2014, in Hong Kong, China. The aim of this international convention is to bring together experts and scholars from around the world and offer them a chance to share the latest research results in the field of Energy and Power Engineering. We all know that over the past few decades, a great change has happened in the field of the environment technology, and the science technology is

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  • Publisher : Springer Nature
  • Release : 17 October 2020
GET THIS BOOK Nano Bio Electronic Photonic and MEMS Packaging

This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources,

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  • Publisher : Springer Science & Business Media
  • Release : 17 September 2013
GET THIS BOOK Thermal Management for LED Applications

Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials)

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  • Publisher : Springer
  • Release : 11 July 2017
GET THIS BOOK Solid State Lighting Reliability Part 2

In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and

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  • Publisher : John Wiley & Sons
  • Release : 08 March 2011
GET THIS BOOK Failure Analysis

Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers

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  • Publisher : Elsevier
  • Release : 09 March 2017
GET THIS BOOK Reliability Investigation of LED Devices for Public Light Applications

Reliability Investigation of LED Devices for Public Light Applications focuses on state-of-the-art GaN-based LED technology through the study of typical failure mechanisms in public lighting applications. Across the different chapters, the reader will explore the tools and analyses involved in the study and application of a number of different LED devices. The authors review GaN-based LED technology by focusing on the main failure mechanisms targeting polymer-based packaging, thanks to electrical and spectral models. The proposed technology and methodologies will help

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  • Publisher : Academic Press
  • Release : 25 September 2017
GET THIS BOOK Organosilicon Compounds

Organosilicon Compounds: Experiment (Physico-Chemical Studies) and Applications, volume 2, also contains two parts. In its first part, Experiment (Physico-Chemical Studies), the application of modern instrumental tools (such as X-ray crystallography, 29Si NMR spectroscopy, UV-Photoelectron Spectroscopy, and other methods) for assessing the structures of organosilicon compounds is described. The second part, Applications, reviews the current research in the field of material science, specifically the use of organosilicon compounds in synthetic chemistry directed towards the creation of new materials. Organosilicon Compounds: From Theory

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  • Release : 18 May 2017
GET THIS BOOK III Nitride Based Light Emitting Diodes and Applications

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  • Publisher : John Wiley & Sons
  • Release : 15 November 2021
GET THIS BOOK From LED to Solid State Lighting

A comprehensive reference including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field • An introductory/intermediate level treatment including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field • The authors lead a LED packaging R&D center with an industrial grade prototyping line and state-of-the-art facilities for materials/optical/electrical/thermal characterization. A substantial amount of technical contents in this book is based on the hands-on experience and

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  • Publisher : Artech House
  • Release : 03 December 2021
GET THIS BOOK Component Reliability for Electronic Systems

The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype,