Modeling Analysis Design and Testing for Electronics Packaging Beyond Moore

Produk Detail:
  • Author : Hengyun Zhang
  • Publisher : Woodhead Publishing
  • Pages : 425 pages
  • ISBN : 9780081025321
  • Rating : /5 from reviews
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Download or Read online Modeling Analysis Design and Testing for Electronics Packaging Beyond Moore full in PDF, ePub and kindle. this book written by Hengyun Zhang and published by Woodhead Publishing which was released on 15 September 2019 with total page 425 pages. We cannot guarantee that Modeling Analysis Design and Testing for Electronics Packaging Beyond Moore book is available in the library, click Get Book button and read full online book in your kindle, tablet, IPAD, PC or mobile whenever and wherever You Like. Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging