Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

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  • Author : Hengyun Zhang
  • Publisher : Woodhead Publishing
  • Pages : 434 pages
  • ISBN : 0081025335
  • Rating : /5 from reviews
CLICK HERE TO GET THIS BOOK >>>Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

Download or Read online Modeling Analysis Design and Tests for Electronics Packaging beyond Moore full in PDF, ePub and kindle. this book written by Hengyun Zhang and published by Woodhead Publishing which was released on 22 November 2019 with total page 434 pages. We cannot guarantee that Modeling Analysis Design and Tests for Electronics Packaging beyond Moore book is available in the library, click Get Book button and read full online book in your kindle, tablet, IPAD, PC or mobile whenever and wherever You Like. Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

Modeling  Analysis  Design  and Tests for Electronics Packaging beyond Moore
  • Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
  • Publisher : Woodhead Publishing
  • Release : 22 November 2019
GET THIS BOOK Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

Modeling Analysis Design and Testing for Electronics Packaging Beyond Moore

Modeling  Analysis  Design and Testing for Electronics Packaging Beyond Moore
  • Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
  • Publisher : Woodhead Publishing
  • Release : 15 September 2019
GET THIS BOOK Modeling Analysis Design and Testing for Electronics Packaging Beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

Advances in Robotics Automation and Data Analytics

Advances in Robotics  Automation and Data Analytics
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  • Publisher : Springer Nature
  • Release : 10 March 2021
GET THIS BOOK Advances in Robotics Automation and Data Analytics

This book presents essentially a collection of proceedings that deliberate on the key challenges and recent trends on robotics, automation and data analytics which are the pillars of Industry 4.0. Solutions that are employed in the multitude spectra of innovative robotics & automation and data analytics are discussed. The readers are expected to gain an insightful view on the current trends, issues, mitigating factors as well as solutions from the book. This book consists of selected papers presented at the 2nd International

Heat Exchangers

Heat Exchangers
  • Author : Laura Castro Gómez,Víctor Manuel Velázquez Flores,Miriam Navarrete Procopio
  • Publisher : BoD – Books on Demand
  • Release : 23 March 2022
GET THIS BOOK Heat Exchangers

The demand for energy to satisfy the basic needs and services of the population worldwide is increasing as are the economic costs associated with energy production. As such, it is essential to emphasize energy recovery systems to improve heat transfer in thermal processes. Currently, significant research efforts are being conducted to expose criteria and analysis techniques for the design of heat exchange equipment. This book discusses optimization of heat exchangers, heat transfer in novel working fluids, and the experimental and

More than Moore

More than Moore
  • Author : Guo Qi Zhang,Alfred van Roosmalen
  • Publisher : Springer Science & Business Media
  • Release : 23 January 2010
GET THIS BOOK More than Moore

In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.

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  • Author : Khaled Salah,Yehea Ismail,Alaa El-Rouby
  • Publisher : Springer
  • Release : 21 August 2014
GET THIS BOOK Arbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as

Routing Congestion in VLSI Circuits

Routing Congestion in VLSI Circuits
  • Author : Prashant Saxena,Rupesh S. Shelar,Sachin Sapatnekar
  • Publisher : Springer Science & Business Media
  • Release : 27 April 2007
GET THIS BOOK Routing Congestion in VLSI Circuits

This volume provides a complete understanding of the fundamental causes of routing congestion in present-day and next-generation VLSI circuits, offers techniques for estimating and relieving congestion, and provides a critical analysis of the accuracy and effectiveness of these techniques. The book includes metrics and optimization techniques for routing congestion at various stages of the VLSI design flow. The subjects covered include an explanation of why the problem of congestion is important and how it will trend, plus definitions of metrics

Advanced Nanoelectronics

Advanced Nanoelectronics
  • Author : Muhammad Mustafa Hussain
  • Publisher : John Wiley & Sons
  • Release : 04 January 2019
GET THIS BOOK Advanced Nanoelectronics

Brings novel insights to a vibrant research area with high application potential?covering materials, physics, architecture, and integration aspects of future generation CMOS electronics technology Over the last four decades we have seen tremendous growth in semiconductor electronics. This growth has been fueled by the matured complementary metal oxide semiconductor (CMOS) technology. This comprehensive book captures the novel device options in CMOS technology that can be realized using non-silicon semiconductors. It discusses germanium, III-V materials, carbon nanotubes and graphene as

High Performance Integrated Circuit Design

High Performance Integrated Circuit Design
  • Author : Emre Salman,Eby Friedman
  • Publisher : McGraw Hill Professional
  • Release : 21 August 2012
GET THIS BOOK High Performance Integrated Circuit Design

The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to