Advances in CMP Polishing Technologies

• Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
• Publisher : William Andrew
• Release : 06 December 2011

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This

• Author : Suryadevara Babu
• Publisher : Woodhead Publishing
• Release : 24 September 2021

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric

• Author : Jianbin Luo,Yonggang Meng,Tianmin Shao,Qian Zhao
• Publisher : Springer Science & Business Media
• Release : 16 July 2010

"Advanced Tribology" is the proceedings of the 5th China International Symposium on Tribology (held every four years) and the 1st International Tribology Symposium of IFToMM, held in Beijing 24th-27th September 2008. It contains seven parts: lubrication; friction and wear; micro/nano-tribology; tribology of coatings, surface and interface; biotribology; tribo-chemistry; industry tribology. The book reflects the recent progress in the fields such as lubrication, friction and wear, coatings, and precision manufacture etc. in the world. The book is intended for researchers,

• Author : Imin Kao,Chunhui Chung
• Publisher : John Wiley & Sons
• Release : 11 January 2021

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

• Author : S. Das,G. Kibria,B. Doloi,B. Bhattacharyya
• Publisher : Springer Nature
• Release : 10 May 2020

This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with

• Author : R. Rhoades,G. Banerjee,B. Basim,L. Economikos,D. Huang,Y. Obeng
• Publisher : The Electrochemical Society
• Release : 21 September 2016

• Author : Peter J. Blau
• Publisher : CRC Press
• Release : 19 December 2017

Tribosystem Analysis: A Practical Approach to the Diagnosis of Wear Problems provides a systematic framework for conducting root cause analyses and categorizing various types of wear. Designed specifically for engineers without formal training in tribology, this book: Describes a number of direct and indirect methods for detecting and quantifying wear problems Surveys different microscopy techniques, including those for light optics, electron optics, and acoustic imaging Discusses the selection of wear and friction test methods, both standard and custom, identifying possible

• Author : Chatchawal Wongchoosuk
• Publisher : BoD – Books on Demand
• Release : 26 October 2022

Boron is a chemical element with three valence electrons for forming covalent bonds, resulting in many compounds. Doping/integration of boron atoms into other atoms provides new wonder materials with unique physical, chemical, and electrical properties. This book provides an overview of the research and developments of boron-based materials such as boron nitride, boron clusters, boron doping, boron compounds, and so on. Chapters cover all aspects of boron-based materials including theoretical backgrounds of structure and properties, computer simulation, synthesis techniques,

• Author : Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
• Publisher : John Wiley & Sons
• Release : 17 February 2012

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers

• Author : Ioan D. Marinescu,Eckart Uhlmann,Toshiro Doi
• Publisher : CRC Press
• Release : 20 November 2006

Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice. Collecting decisive work contributed by industrial and academic experts from

• Author : F. Roozeboom,H. Jagannathan,K. Kakushima,P. J. Timans,E. P. Gusev,Z. Karim,S. De Gendt
• Publisher : The Electrochemical Society
• Release : 07 June 2023

• Author : Meiyong Liao,Bo Shen,Zhanguo Wang
• Publisher : Elsevier
• Release : 18 June 2019

Ultra-wide Bandgap Semiconductors (UWBG) covers the most recent progress in UWBG materials, including sections on high-Al-content AlGaN, diamond, B-Ga2O3, and boron nitrides. The coverage of these materials is comprehensive, addressing materials growth, physics properties, doping, device design, fabrication and performance. The most relevant and important applications are covered, including power electronics, RF electronics and DUV optoelectronics. There is also a chapter on novel structures based on UWBG, such as the heterojunctions, the low-dimensional structures, and their devices. This book

• Author : Anonim
• Publisher : Unknown
• Release : 07 June 1999

• Author : Shrikrishna Nandkishor Joshi,Pranjal Chandra
• Publisher : Springer Nature
• Release : 01 October 2021

This volume focuses on the fundamentals and advancements in micro and nanomanufacturing technologies applied in the biomedical and biochemical domain. The contents of this volume provide comprehensive coverage of the physical principles of advanced manufacturing technologies and the know-how of their applications in the fabrication of biomedical devices and systems. The book begins by documenting the journey of miniaturization and micro-and nano-fabrication. It then delves into the fundamentals of various advanced technologies such as micro-wire moulding, 3D printing, lithography, imprinting,

• Author : Yosi Shacham-Diamand,Tetsuya Osaka,Madhav Datta,Takayuki Ohba
• Publisher : Springer Science & Business Media
• Release : 19 September 2009

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation