Advances in Chemical Mechanical Planarization Cmp

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  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing Limited
  • Pages : 810 pages
  • ISBN : 9780081001653
  • Rating : /5 from reviews
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Download or Read online Advances in Chemical Mechanical Planarization Cmp full in PDF, ePub and kindle. this book written by Suryadevara Babu and published by Woodhead Publishing Limited which was released on 12 January 2016 with total page 810 pages. We cannot guarantee that Advances in Chemical Mechanical Planarization Cmp book is available in the library, click Get Book button and read full online book in your kindle, tablet, IPAD, PC or mobile whenever and wherever You Like. Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Advances in Chemical Mechanical Planarization Cmp

Advances in Chemical Mechanical Planarization  Cmp
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing Limited
  • Release : 12 January 2016
GET THIS BOOK Advances in Chemical Mechanical Planarization Cmp

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of

Advances in CMP polishing Technologies for the Manufacture of Electronic Devices

Advances in CMP polishing Technologies for the Manufacture of Electronic Devices
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 01 December 2011
GET THIS BOOK Advances in CMP polishing Technologies for the Manufacture of Electronic Devices

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This

Advances in Chemical Mechanical Polishing Volume 816

Advances in Chemical Mechanical Polishing  Volume 816
  • Author : Materials Research Society. Meeting
  • Publisher : Unknown
  • Release : 01 September 2004
GET THIS BOOK Advances in Chemical Mechanical Polishing Volume 816

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other

Advances and Challenges in Chemical Mechanical Planarization

Advances and Challenges in Chemical Mechanical Planarization
  • Author : Gerfried Zwicker,Christopher Borst,Laertis Economikos,Ara Philipossian
  • Publisher : Cambridge University Press
  • Release : 05 June 2014
GET THIS BOOK Advances and Challenges in Chemical Mechanical Planarization

Chemical mechanical planarization (CMP) has been a leading-edge technology in semiconductor processing for the past 15−20 years. A successful CMP process is based in fundamental science across the disciplines of mechanical engineering, chemical engineering, colloid science, materials science and chemistry. Traditionally, the MRS Spring Meeting serves as a nexus for multidisciplinary interaction and discussion between CMP researchers in both industry and academia. The papers in this book are from the 2007 MRS Spring Meeting and address the fluid and wear mechanics that

Advances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization  CMP
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 24 September 2021
GET THIS BOOK Advances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric

Advances in Chemical Mechanical Polishing

Advances in Chemical Mechanical Polishing
  • Author : Duane S. Boning,Johann W. Bartha,Ara Philipossian,Greg Shinn,Ingrid Vos
  • Publisher : Cambridge University Press
  • Release : 05 June 2014
GET THIS BOOK Advances in Chemical Mechanical Polishing

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other

Chemical Mechanical Planarization Volume 767

Chemical Mechanical Planarization  Volume 767
  • Author : Duane S. Boning,Katia Devriendt,Michael R. Oliver,David J. Stein,Ingrid Vos
  • Publisher : Mrs Proceedings
  • Release : 27 August 2003
GET THIS BOOK Chemical Mechanical Planarization Volume 767

Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and

Chemical Mechanical Planarization Volume 867

Chemical Mechanical Planarization  Volume 867
  • Author : Materials Research Society. Meeting
  • Publisher : Cambridge University Press
  • Release : 19 July 2005
GET THIS BOOK Chemical Mechanical Planarization Volume 867

Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends

Chemical Mechanical Polishing 2001 Advances and Future Challenges

Chemical Mechanical Polishing 2001   Advances and Future Challenges
  • Author : Suryadevara V. Babu,Kenneth C. Cadien,Hiroyuki Yano
  • Publisher : Cambridge University Press
  • Release : 05 June 2014
GET THIS BOOK Chemical Mechanical Polishing 2001 Advances and Future Challenges

With copper and barrier-layer integration firmly in place, several other exciting developments are occurring in the practice of chemical-mechanical polishing (CMP), and many advances are described in this book, first published in 2001. Discussions on CMP for shallow-trench isolation, abrasive-free slurries, improvements in pad and tool configurations including fixed abrasive pads, 'engineered' particles, effects of nanotopography, end-point studies, defect characterization and novel post-CMP cleaning methods are highlighted. Considerable progress has also been reported in modeling the complicated interactions that occur between

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization
  • Author : Yuzhuo Li
  • Publisher : John Wiley & Sons
  • Release : 28 September 2021
GET THIS BOOK Microelectronic Applications of Chemical Mechanical Planarization

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals

Advances in CMP Polishing Technologies

Advances in CMP Polishing Technologies
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 30 November 2011
GET THIS BOOK Advances in CMP Polishing Technologies

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book